A Technology To Reduce Pad Cratering Defects And The Impact On Product CostAuthors: Chet A. Palesko, Amy J. Palesko; and Chris Hunrath, Ken Parent
Company: SavanSys Solutions, LLC and Integral Technology
Date Published: 10/13/2013 Conference: SMTA International
In this paper, we describe a technology and manufacturing process which reduces pad cratering defects. A complete product cost analysis of this process, including breakeven and sensitivity analysis, is carried out using activity based cost models.
Cost modeling, pad cratering, PCB fabrication cost
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