SMTA International Conference Proceedings


A Technology To Reduce Pad Cratering Defects And The Impact On Product Cost

Authors: Chet A. Palesko, Amy J. Palesko; and Chris Hunrath, Ken Parent
Company: SavanSys Solutions, LLC and Integral Technology
Date Published: 10/13/2013   Conference: SMTA International


Abstract: While any printed circuit board manufacturing defect is expensive, pad cratering defects are particularly costly. These defects are almost impossible to rework, and they are usually detected at the end of the process. All components, the PCB, and the cost of fabricating and assembling the board is scrapped. An even worse situation than finding the defect at the end of the process is not detecting it at all. This leads to even more expensive customer failures and product returns.

In this paper, we describe a technology and manufacturing process which reduces pad cratering defects. A complete product cost analysis of this process, including breakeven and sensitivity analysis, is carried out using activity based cost models.

Key Words: 

Cost modeling, pad cratering, PCB fabrication cost



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