SMTA International Conference Proceedings

Underfill Encapsulants And Edgebond Adhesives For Enhancing Of Board Level Reliability

Authors: Simon Chang, Edward S. Ibe, and Karl I. Loh
Company: Zymet, Inc
Date Published: 10/13/2013   Conference: SMTA International

Abstract: With the proliferation of area array packages in consumer, enterprise, military, and automotive electronics, a wide range of board level underfills and edgebond adhesives, reworkable and non-reworkable, have been developed to ruggedize these components. While these materials are used to enhance drop test, bend test, and vibration test performance, their use can affect thermal cycle performance, negatively or positively. The trade-offs between process performance, rework, and reliability, along with advances to overcome the trade-offs are discussed.

Key Words: 

underfill, edgebond, cornerbond, adhesive, BGA, CSP, POP, WLP, WL-CSP, drop, bend, vibration, ruggedization, thermal cycle, board level reliability

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