Solder Joint Encapsulant Adhesive – Pop TMV High Reliability And Low Cost Assembly SolutionAuthors: Mary Liu, Ph.D. and Wusheng Yin, Ph.D.
Company: YINCAE Advanced Materials, LLC
Date Published: 10/13/2013 Conference: SMTA International
YINCAE solder joint encapsulant adhesives - SMT 256 and SMT 266 series are applied by printing, dipping or jetting process onto a substrate or component. They can remove metal oxide from pads and bumps to allow solder joint to form. SMT 256 and SMT 266 are then cured with the formation of 3-D polymer network encapsulating each individual solder joint; there is no adhesive in between solder joints blocking outgassing channels to ensure process yield. After using solder joint encapsulant adhesive for POP TMV assembly, the pull strength of solder joint is increased about five times and the SIR drop issue is addressed with high process yield. All details such as assembly process, drop test and thermal cycling test will be discussed in the full paper.
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