Electronic Assembly Misprint Cleaning AdvancementsAuthors: Mike Bixenman, DBA and Dirk Ellis; Jody Saultz, Eric Becker, Greg Calvo and Jim Morris
Company: Kyzen Corporation and Speedline Technologies
Date Published: 10/13/2013 Conference: SMTA International
The purpose of this research is to test and validate new cleaning equipment innovations that allow for misprints to be cleaned from electronic assembly batch and inline production cleaning equipment. Cleaning misprints within production spray-in-air cleaning equipment has been looked down upon due to wet solder paste accumulating within the wash tank. Free solder spheres that are picked up by the pump can be wedged and deposited onto production assemblies. Recent cleaning equipment innovations have been developed to trap, collect and filter wet paste removed from misprints. Designed experiments will be run to test the robustness of the process and validate cleaning of both wet solder paste and reflowed flux residues.
Electronic Assembly Cleaning, Stencil Printing, Misprint Rework, Batch Cleaning Machines, Inline Cleaning Machines, B-Side Misprint Cleaning
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