Optimizing Assembly Of QFNsAuthors: Brook Sandy-Smith and Seth Homer
Company: Indium Corporation
Date Published: 10/13/2013 Conference: SMTA International
In previous work, it has been observed, that some of these proven approaches impact the integrity of QFN assemblies more than just the amount of voiding. For instance, the size and placement of vias in these thermal pads can be optimized to minimize voiding and help with heat dissipation. However, these vias can also draw solder volume away from the solder joint, resulting in a large variance in voiding results, as well as in the loss of standoff height. In order to further define “best practices to minimize QFN voiding”, several combinations of proven approaches were tested on a user-defined test board and fully analyzed to gain understanding of QFN performance, in addition to typical voiding results.
voiding, thermal pad design, QFN assembly, low-voiding, solder paste
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