SMTA International Conference Proceedings

Voiding Mitigation For Bottom Terminated Components

Authors: Jennifer Nguyen, David Geiger and Murad Kurwa
Company: Flextronics International
Date Published: 10/13/2013   Conference: SMTA International

Abstract: Bottom terminated components (BTCs) are widely used today in many products due to its small size, low cost and good electrical and thermal performance. Assembly of BTC has many challenges. Voiding, especially at the thermal pad, is the most common defect and concern with BTC component assembly. Since most BTC components are unique and available in different size, lead count, and design, the mitigation method that works for one BTC component type may not work for another BTC component. This paper will discuss various mitigation techniques to minimize voiding in BTC components.

Key Words: 

voids, voiding, voiding mitigation, bottom terminated component, bottom termination component, BTC, land grid array (LGA), quad flat no lead (QFN)

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