SMTA International Conference Proceedings

Alloy And Process Optimization For Low Ag Solders

Authors: Timothy Jensen and Edward Briggs
Company: Indium Corporation
Date Published: 10/13/2013   Conference: SMTA International

Abstract: In the early 2000’s as the electronics manufacturing industry began to transition to Pb-Free, there was a significant amount of work done researching alloys. Ultimately, the majority of the industry settled on SAC305 which has a composition of 96.5% Sn, 3.0% Ag, and 0.5% Cu. While this alloy has been successfully used for the past 10 years, it isn’t without its challenges. There are a number of alternative alloys being developed and actually in use within the industry. Unfortunately, there is no panacea when it comes to alloys. The needs for electronics are broad and the likelihood of a single alloy meeting all the industry needs is slim. Therefore, it is critical to understand the alloy differences and the impact of the assembly process as well as finished product reliability.

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