SMTA International Conference Proceedings

Effect Of Variation In The Reflow Profile On The Microstructure Of Near Eutectic SnAgCu Alloys

Authors: Francis Mutuku, Babak Arfaei, Ph. D. and Eric J. Cotts, Ph.D
Company: Binghamton University
Date Published: 10/13/2013   Conference: SMTA International

Abstract: Changes in solder composition have significant effects on near eutectic SnAgCu solder joint microstructure and reliability. Both changes in precipitate and Sn grain morphologies have been correlated with changes in failure rates in these Pb free alloys. The present study examines the effects that changes in thermal history (changes in the reflow profile) have on solder joint microstructure. The effects of variations in the reflow temperature, and of variations in the cooling rate from the melt, on the microstructure of near eutectic lead free SnAgCu solder joints were investigated.

Key Words: 

undercooling solidification, differential scanning calorimetry (DSC), solidification microstructure, scanning electron microscopy (SEM) SnAgCu

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