SMTA International Conference Proceedings

Ultra Fine Pitch Reballing –What Needs To Change?

Authors: Don Naugler and Robert Wettermann
Company: VJ Electronix and BEST Inc.
Date Published: 10/13/2013   Conference: SMTA International

Abstract: As handheld device designers continue to put pressure on the reduction of active device footprints, area array device packages continue to shrink. This shrinkage, along with the commonplace usage of underfills, has made the re-use of these devices through the reballing process less the norm. However, there are still many cases where reballing is required, especially in cases where the processor or memory has a high replacement cost or where a failed device needs to be pulled off in order to be analyzed by the reliability and quality staffs at the device OEM. This discussion presents the challenges of deballing and reballing these small, uBGA (0.3mm pitch) packages as well as current methods for successfully deballing and reballing these small packages. This study will determine the stress on the die package using a variety of deballing methods, the mechanical strength of the interconnect and what anomalies there may be in using different methods of reballing or deballing.

Key Words: 

BGA reballing, rework, solder excavating

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