EVALUATION OF EUTECTIC SOLDER BUMP INTERCONNECT TECHNOLOGY FOR DIRECT CHIP ATTACH APPLICATIONS
Author: CraigBeddingfield Company: Motorola Date Published: 8/23/1998
Surface Mount International
Abstract: This paper will describe the methodology and results of an evaluation of the reliability performance and mechanical integrity of the electroplated solder bump interconnect technology for direct chip attach applications. Evaluations include studying the effects of several variables, including (a) the solder bump volume (determined by bump height and diameter), (b) the integrated circuit bond pad configuration (using various passivation opening and under bump metalization diameters), and (c) the underfill material type. The analysis of each of these variables as main effects and in most cases interaction effects was achieved by performing mechanical and environmental testing including solder bump and under bump metalization (UBM) shear strength, die tensile pull, air-to-air temperature cycling (AATC) at a range of-55/1 25°C and liquid-to-liquid thermal shock (LLTS) at a range -55/125°C. The intent of this study was to determine the significance of the variables.