SMTA International Conference Proceedings


VOLUME MANUFACTURING CHALLENGES OF HDI

Author: Mason Hu
Company: HADCO Santa Clara
Date Published: 9/12/1999   Conference: SMTA International


Abstract: When people talked about microvias a few years ago, the subject usually focused around the alternatives in via formation. Today, as the designers are packing more functionality into limited space, the PWB manufacturers are also busy turning out integrated high density interconnect (HDI) solutions. In this article, we will review the market trends of HDI technology, discuss the manufacturing challenges: via formation, registration and plating.



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