SMTA International Conference Proceedings


Can Nano-Coatings Really Improve Stencil Performance?

Author: Tony Lentz
Company: FCT Assembly
Date Published: 10/13/2013   Conference: SMTA International


Abstract: The trajectory of electronic design and its associated miniaturization shows no signs of altering course. Surface Mount Technology will require innovative materials and processes to stay in lockstep with other segments of the electronics industry.

Nano-coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include: Reduced underside cleaning, reduced bridging, improved solder paste release and improvements in yield. With several nano technologies already on the market and more likely to be introduced, how can the performance be quantified? How robust are these coatings? How can an assembler approach the ROI of these coatings? What hidden benefits or negative impacts should be considered?

This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings. Criterion such as underside cleaning, bridging, transfer efficiency across SARs, solder paste deposit geometry, post-print cleaning, and abrasion resistance of the coating, will all be considered and weighted. Performance of currently available coatings will be compared. A discussion of the economic impact on current and future SMT design will be included.

Key Words: 

Nano-coating, stencil, transfer efficiency, underside cleaning, bridging, solder paste release



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