Stencil And Solder Paste Inspection Evaluation For Miniaturized SMT ComponentsAuthors: Robert Farrell and Chrys Shea
Company: Benchmark Technologies and Shea Engineering Services
Date Published: 10/13/2013 Conference: SMTA International
The test also evaluated two methods of automated solder paste inspection to determine the accuracy and repeatability of the different machines and technologies at feature sizes of 10 mil or less. Setup, execution and results of both sets of tests are presented and discussed.
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