SMTA International Conference Proceedings

Stencil And Solder Paste Inspection Evaluation For Miniaturized SMT Components

Authors: Robert Farrell and Chrys Shea
Company: Benchmark Technologies and Shea Engineering Services
Date Published: 10/13/2013   Conference: SMTA International

Abstract: New stencil materials and manufacturing technologies promise improved performance over traditional options. To determine the best technologies for a contract electronics manufacturer assembling miniaturized SMT components, a test was designed to assess the performance of 11 different stencils, submitted by 3 different suppliers, using a variety of materials and coatings. Performance metrics include print volume repeatability and transfer efficiency for 0.5mm and 0.4mm pitch BGAs and for 0201 components with area ratios in the challenging range from 0.5 to 0.66.

The test also evaluated two methods of automated solder paste inspection to determine the accuracy and repeatability of the different machines and technologies at feature sizes of 10 mil or less. Setup, execution and results of both sets of tests are presented and discussed.

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