Jetetch Cuprotect And Copper IC InspectionAuthor: Erik Jordan
Company: Nisene Technology Group
Date Published: 10/13/2013 Conference: SMTA International
The JetEtch CuPROTECT decapsulation system employs a combination of hardware and software in a proprietary, and patent pending application of electrical current to the sample being etched such that the sensitive internal wiring is shielded from the caustic etching properties of the acid during the etch process.
Through dozens of trial decapsulations and customer demo decapsulations, we have been able to establish a consistent and repeatable process to open a variety of copper bonded samples including samples with varying purity of copper, fine pitch copper wires, palladium coated wires, copper coils, and more.
The CuPROTECT is made possible by applying an electrical bias to the component during decap so that corrosive properties of the chemicals used during decap can be repelled, thus limiting the corrosion of copper components.
Because of the demand for not only successful decap of a sample, but also electrical functionality post-decap, it is critical to note that no ESD damage has been found as a result of the Nisene CuPROTECT process.
Supporting documents and sample images are available for review and support of above claims of the CuPROTECT process. We will present the technology behind the CuPROTECT process as well as display supporting documents proving the process function and effectiveness.
copper decapsulation, decap, wire thinning, wire pitting, wire corrosion, copper bond wires.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.