SMTA International Conference Proceedings


Jetetch Cuprotect And Copper IC Inspection

Author: Erik Jordan
Company: Nisene Technology Group
Date Published: 10/13/2013   Conference: SMTA International


Abstract: With a shift in the manufacturing of semiconductor integrated circuits from gold wires and bonding to copper, the failure analysis of these processors has become increasingly challenging to successfully attain by use of traditional methods. Historically, one would use an automated chemical decapsulation system, such as the JetEtch or something similar in its product line, with a lowtemperature nitric and sulfuric acid mixture. This process works to an extent, and with a limited number of sample types and configurations. Not all samples can be etched successfully with conventional methods, so Nisene Technology Group created a new decapsulation process to safely decapsulation when copper bond wires are present.

The JetEtch CuPROTECT decapsulation system employs a combination of hardware and software in a proprietary, and patent pending application of electrical current to the sample being etched such that the sensitive internal wiring is shielded from the caustic etching properties of the acid during the etch process.

Through dozens of trial decapsulations and customer demo decapsulations, we have been able to establish a consistent and repeatable process to open a variety of copper bonded samples including samples with varying purity of copper, fine pitch copper wires, palladium coated wires, copper coils, and more.

The CuPROTECT is made possible by applying an electrical bias to the component during decap so that corrosive properties of the chemicals used during decap can be repelled, thus limiting the corrosion of copper components.

Because of the demand for not only successful decap of a sample, but also electrical functionality post-decap, it is critical to note that no ESD damage has been found as a result of the Nisene CuPROTECT process.

Supporting documents and sample images are available for review and support of above claims of the CuPROTECT process. We will present the technology behind the CuPROTECT process as well as display supporting documents proving the process function and effectiveness.

Key Words: 

copper decapsulation, decap, wire thinning, wire pitting, wire corrosion, copper bond wires.



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