ADVANCES IN CHIP SCALE PACKAGINGAuthor: Ron Bauer
Company: Intel Corporation
Date Published: 8/23/1998 Conference: Surface Mount International
The rapid acceptance of CSP’s and µBGA packages, combined with decreasing design and prototyping cycles, makes design and manufacturing tools a much more important part of the total end product solution. Design tools simplify the product development process and decrease time-to-market for products. Manufacturing tools address areas of concern in the high volume manufacturing process, such as PCB assembly component rework. This paper will also discuss Design, Debug, and Manufacturing tools that are available for the µBGA package.
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