Surface Mount International Conference Proceedings


ADVANCES IN CHIP SCALE PACKAGING

Author: Ron Bauer
Company: Intel Corporation
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: Chip Scale Packages (CSP’s), such as the µBGA* package, have enabled a new generation of very small consumer products. There has been rapid acceptance of Chip Scale packages, mostly fueled by mobile telecommunications products. Intel Corporation has qualified and has been in high volume production of Flash Memory devices in the µBGA* package since mid-1997. This paper will show quality and reliability test results for these packages.

The rapid acceptance of CSP’s and µBGA packages, combined with decreasing design and prototyping cycles, makes design and manufacturing tools a much more important part of the total end product solution. Design tools simplify the product development process and decrease time-to-market for products. Manufacturing tools address areas of concern in the high volume manufacturing process, such as PCB assembly component rework. This paper will also discuss Design, Debug, and Manufacturing tools that are available for the µBGA package.



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