SMTA International Conference Proceedings


A Method For Quickly Evaluating Aluminum Pad Corrosion

Author: Terence Q. Collier
Company: CVInc.
Date Published: 10/13/2013   Conference: SMTA International


Abstract: Contaminated and corroded aluminum bond pads can lead to a number of reliability failures. Poor wirebondability, false failures at electrical probe due to high contact resistance, opens on RDL layers due to incomplete sputter, and various early life failures during JEDEC/ASTM testing can all be attributed to excess oxidation and corrosion on aluminum bond pads.

How does one evaluate bond pads non-destructively? One can perform combinations of Auger, SIMMS and FTIR but there is a chance the die can be damaged and the spot size of the beams in these tools can be sample areas outside the target location. The cycle time and costs of these tests are also issue for customers wanting quick response from failure analysis. Is there a speedy process for bond pad evaluation while salvaging the die? Sure

A better method is to bond the die with a gold stud bump followed by etching away the gold. Selective etching the gold highlights the intermetallics revealing the ratio of gold to aluminum bonding versus gold to oxide.

Key Words: 

Aluminum pad cleaning, bond pad corrosion, gold etch, wirebond reliability



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