A Method For Quickly Evaluating Aluminum Pad CorrosionAuthor: Terence Q. Collier
Date Published: 10/13/2013 Conference: SMTA International
How does one evaluate bond pads non-destructively? One can perform combinations of Auger, SIMMS and FTIR but there is a chance the die can be damaged and the spot size of the beams in these tools can be sample areas outside the target location. The cycle time and costs of these tests are also issue for customers wanting quick response from failure analysis. Is there a speedy process for bond pad evaluation while salvaging the die? Sure
A better method is to bond the die with a gold stud bump followed by etching away the gold. Selective etching the gold highlights the intermetallics revealing the ratio of gold to aluminum bonding versus gold to oxide.
Aluminum pad cleaning, bond pad corrosion, gold etch, wirebond reliability
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.