Understanding Electrical Leakage And Electrochemical Migration In ElectronicsAuthor: Eric Camden
Date Published: 10/13/2013 Conference: SMTA International
This paper describes what residues are found after board fabrication, SMT, after full or selective wave, and after hand soldering on the PCBA. We will also showcase three electrochemical failures showing the SEM/EDS analysis and comparing it to localized C3 steam extraction and Ion Chromatography analysis to determine root cause and corrective action. These failures are due to flux and other fabrication residues causing electrical leakage and/or dendrite growth and shorting hardware in a normal end use environment, including samples under conformal coating.
Reliability, electrical leakage, electrochemical migration, dendrite, failures
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