SMTA International Conference Proceedings


Benefit And Challenges Of Manufacturing With Printed Circuit Board Cavities

Authors: Pedro J. Martinez, William O. Alger, Weston C. Roth, and Sanjay Goyal
Company: Intel Corporation
Date Published: 10/13/2013   Conference: SMTA International


Abstract: Cavity technology in a Printed Circuit Boards (PCB) has existed for many years. The methodology to create the cavity in the PCB has changed over time as technologies have advanced and the manufacturing process varies by the individual PCB fabricator as well as the reasons for using the cavity technology. For the purpose of this paper, a cavity will be defined as a hole in the PCB going from the outer copper layer to an inner copper layer, but not completely through the PCB. The cavity design and assembly issues identified during the design of experiments (DOE’s), the findings, reliability results, and conclusions will be discussed in this paper.

Key Words: 

PCB, cavity, and depth



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