Alternative Lead-Free Alloys For SMT AssemblyAuthor: Karl F. Seelig
Date Published: 10/13/2013 Conference: SMTA International
Conversely, implementation of alternative alloys for SMT assembly has not moved as quickly. This is mainly due to the perceived need for increased reflow temperatures commonly compared to the low SAC305 reflow temperature of 217°C.
This paper will examine the risks involved when changing alloys, including tin whisker growth, head in pillow (HiP) mitigation, drop shock performance, and flux compatibility. Mechanical data and testing procedures will be included, providing the user with valuable insight into initial alloy composition versus the alternative.
lead-free, alternative alloys, SAC305, Sn/Bi/Cu/Ag, Aged, Non-aged.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.