Low Temperature Alloy Development For Electronics Assembly – Part IIAuthors: Morgana Ribas, Ph.D., Sujatha Chegudi, Anil Kumar, Sutapa Mukherjee, Siuli Sarkar, Ph.D.; Ranjit Pandher, Ph.D., Rahul Raut, and Bawa Singh, Ph.D.
Company: Alpha, an Alent plc Company
Date Published: 10/13/2013 Conference: SMTA International
This paper summarizes basic alloy properties, including mechanical, thermal and electrical properties, and paste attributes of a set of new Sn-Bi-X alloys, in which X is a micro-additive. Further, comprehensive reliability studies were undertaken for these new low temperature alloys. Thermal Cycling was performed from -40°C to 80°C with a 30 minute dwell time. Drop Shock studies were also under taken as per the JEDEC JESD22-B111 standard. Improvements obtained are compared to standard Sn-Bi systems and discussed here. Overall, Sn-Bi-X alloys present significant enhancements in metallurgical properties, soldering properties for SMT assembly, and in thermal and mechanical reliability
Lead-free, solder alloy, low-temperature alloy, solder joint strength, thermal cycling, reliability.
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