A Study Of Lead-Free Low Silver Solder Alloys With Nickel AdditionsAuthors: Munehiko Nakatsuma, Takehiro Wada, Kimiaki Mori, Koichi Shimokawa, Takeshi Shirai, Atsushi Irisawa, Roberto Garcia, Jasbir Bath
Company: Koki Company Limited and Bath & Associates Consultancy LLC
Date Published: 10/13/2013 Conference: SMTA International
Specifically, this focused on the improved effect on thermal cycling reliability by adding nickel to the SnAgCu type lead-free solder alloys. The study indicated that adding a small amount of nickel to the SnAgCu lead-free solder alloy with around 1% silver content produced equivalent solder joint reliability to conventional Sn3Ag0.5Cu (SAC305). However, reduction of silver content from 3% to 1% increased the melting temperature of solder and may result in a reduced process window during assembly operations. Therefore, additional work was conducted to understand the affect of increasing the process window with the low silver nickel containing lead-free alloy using the addition of bismuth and its subsequent affect on reliability.
The results of the work are reported which include solder paste printing analysis together with mechanical property, melting temperature, wetting, reflow profile window (minimum solder joint peak/ time above melting temperature), voiding, thermal cycling, solder joint strength, visual and cross-sectional analysis of the low silver leadfree soldered joints compared with Sn3Ag0.5Cu.
Lead-free, Low Silver, Reflow, Reflow Profile, Thermal Cycling.
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