Surface Mount International Conference Proceedings


IMPLEMENTING NEW TECHNOLOGIES IN THE ELECTRONICS MANUFACTURING SERVICES ENVIRONMENT A Case Study in Ball Grid Array Qualification

Author: Sammy Yi
Company: Mnfctrs Srvcs Wstrn US Oprtn
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: High technology process development ws once the domain of the OEM, but as packaging technologies emerge with increasing speed, OEMs are turning to electronics manufaturing service (EMS) providers to support the development and qualification of technologies that will reduce time-to-market and cut production costs.

This paper offers a case study in qualifying complex BGAs to meet emerging market needs. It will focus on process development, establishing process capability and defining and implementing a qualification methodology that meets a wide range of technology needs.

The paper will also address the verification of process assembly capabilities through extensive reliability studies.



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