IMPLEMENTING NEW TECHNOLOGIES IN THE ELECTRONICS MANUFACTURING SERVICES ENVIRONMENT A Case Study in Ball Grid Array QualificationAuthor: Sammy Yi
Company: Mnfctrs Srvcs Wstrn US Oprtn
Date Published: 4/28/1997 Conference: Surface Mount International
This paper offers a case study in qualifying complex BGAs to meet emerging market needs. It will focus on process development, establishing process capability and defining and implementing a qualification methodology that meets a wide range of technology needs.
The paper will also address the verification of process assembly capabilities through extensive reliability studies.
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