SMTA International Conference Proceedings


Can Selective Soldering Meet Fine Pitch And Other Trends?

Author: Gerjan Diepstraten
Company: Vitronics Soltec B.V.
Date Published: 10/13/2013   Conference: SMTA International


Abstract: Selective soldering has gained considerable market share over the last several years. The process requires less material (flux, solder, etc.) and the number of required Pin Through Hole components continue to decline.

The roadmaps in the electronics industry address trends with demands that are hard to achieve using today’s basic selective soldering processes. The minimum feasible PTH pitch is defined as 40 MIL [1.00 mm] for the next five years. Preheat temperatures on topside of the board can go up to 160 ºC. To open the process window the next generation selective soldering process has been designed - Selective Soldering 2.0.

Key Words: 

Selective soldering, multi wave, fine pitch, machine repeatability, machine accuracy, lead free soldering.



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