Acceptance Testing Of Pb-Free Bar Solder AlloysAuthors: Elizabeth Elias Benedetto, Aileen Allen, Kris Troxel, Jian Miremadi
Company: Hewlett-Packard Company
Date Published: 10/13/2013 Conference: SMTA International
For the past two years, HP has been analyzing data produced using the protocol for bar alloys. Some low-silver bar alloys, used in wave and miniwave soldering, have been found to be generally acceptable for PCBs up to 93 mil thickness in HP products.
This paper reviews the work completed thus far on these bar solder alloys, including wetting behavior, through-hole solder joint strength, barrel fill, and copper dissolution. The authors also report the changes that have been made to the test protocol.
This assessment approach only establishes the tests and data reporting requirements, not the acceptance criteria for alloys; pass/fail criteria may vary by industry segment, by company, and by product characteristics. The underlying data needed to evaluate new alloys, however, are likely to be similar in most cases. Thus, the assessment method provided in this paper is believed to be relevant across the entire electronics industry.
Pb-free, bar solder alloy, acceptance testing, pin wetted length, copper dissolution, low-silver
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