Lead Tinning Requirements For The 21st CenturyAuthors: Alan Cable and Roger Cox
Company: ACE Production Technologies
Date Published: 10/13/2013 Conference: SMTA International
Molten solder tinning is also used for prevention of gold embrittlement. Successful solder attachment of components to a circuit assembly relies largely on the solderability of surfaces to be joined, establishing optimum thickness of intermetallics for a strong, yet compliant joint. Achieving this requires complimentary chemistries with the appropriate temperatures and dwell times. Many factors necessary for a successful, repeatable and reliable process must be understood and controlled, and the end product finally tested to show that the end result meets or exceeds a customer’s requirements.
This paper examines the need for a two pot, molten solder lead tinning process, what it achieves, and how it is successfully implemented and proven from a solderability proof perspective, including results obtained from XRF analysis, wetting balance measurements and ionic cleanliness testing, in conjunction and in compliance with IPC/EIA JSTD-002 and ANSI/GEIA STD-0006 standards.
Lead-Tinning, Solderability, Tin Whisker Mitigation, Gold Embrittlement, RoHS, High Reliability Components
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