SMTA International Conference Proceedings

Soldering In Nitrogen Atmosphere – Do Quality Aspects Justify The Costs?

Authors: Heike Schlessmann and Ronny Horn, Ph.D.
Company: SEHO Systems GmbH
Date Published: 10/13/2013   Conference: SMTA International

Abstract: Soldering in a nitrogen atmosphere has regained actuality over the past years. The ongoing miniaturization of assemblies resulting in declining pad and conductor pitches is certainly one major reason for this trend. The requirements regarding the quality of solder connections are correspondingly high. Other factors are the raised process temperatures in lead-free applications that go along with an increasing risk for oxidation as well as environmental issues as cleaning of printed circuit boards from solder and flux residues using aggressive liquids can be avoided due to the fact that fluxes may be composed with less harsh activators when soldering in an inert atmosphere.

In decision-making on the use of inert gas there are several issues to be considered. While at first sight the costs for inert gas seem to raise the total production costs, it also has to be taken into account that quality of solder connections will be improved remarkably if the soldering process is performed in an oxygen-deficient environment. This enables cost reduction for repair works thus increasing the profitability of the electronic manufacturing.

Key Words: 

Nitrogen, Wave Soldering, Reflow Soldering, Selective Soldering.

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