Next Generation No-Clean Lead Free Solder Paste Evaluation For Fine Pitch ApplicationsAuthors: Fei Xie, Ph.D., Daniel F. Baldwin, Ph.D., Paul N. Houston, Brian J. Lewis, Han Wu
Company: Engent, Inc.
Date Published: 10/13/2013 Conference: SMTA International
This paper presents the evaluation process and results for thirteen next generation No Clean Lead-Free solder pastes from various solder paste vendors. The study centers on fine-pitch SMT component assembly applications using 0402 and 0201 components. Seven criteria were investigated which included the stencil releasing capability, variation of the printed volumes, wetting capability, flux residue cleaning capability, number of defects after placement and reflow, the intermetallic layer (IML) formation, and the IML thickness growth. The results for each study are presented in this paper. The solder paste with the best performance was chosen and has been implemented in our fine pitch component assembly process.
No-Clean, Solder paste evaluation, Fine pitch component assembly
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