SMTA International Conference Proceedings

Fine Pitch Re-Ball And Reliability

Authors: Harry Schoeller, Ph.D. and Michael Meilunas
Company: Universal Instruments Corporation
Date Published: 10/13/2013   Conference: SMTA International

Abstract: With 0.3mm pitch technology being integrated into the latest designs for smart phones/tablets and on the horizon for many other applications, rework is a major concern for high volume production. One of the steps to successfully adopting a high volume 0.3mm pitch process is developing a robust rework and re-balling procedure. The focus of this investigation is to develop a rework process using a standard rework procedure which could be easily adopted in a high volume manufacturing environment. The performance of reworked assemblies is compared to non-reworked assemblies in both drop/shock and thermal cycling accelerated life testing. The component solder joint microstructures are also compared in terms of Sn grain structure and IMC thickness. Comparison of the reworked and non-reworked assemblies shows no significant difference in N63 life. Failure analysis of the drop tested assemblies found different failure modes for the reworked and non-reworked assemblies.

Key Words: 

0.3mm pitch BGA, rework, re-ball, drop test, thermal cycling

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819