Surface Mount International Conference Proceedings


NON-CONTACT SURFACE PROFILE MEASUREMENT SYSTEM FOR PACKAGING APPLICATIONS

Authors: Anthony Wong,
Company: The Univof Texas at Austin
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: An optical profilometer developed at the University of Texas at Austin has proved to be a versatile tool for critical surface profile measurements in various packaging technologies. The instrument is programmable for automatic scanning and data acquisition. It permits scan lengths as long as a printed circuit panel with an x-y resolution of one micrometer and vertical resolution of 0.5 micrometers. An application of the instrument to measurements critical to the assembly of a TAB package to PWB will be discussed. This involves the measurement of the solder deposit thickness on lands at the attachment site for the outer leads of a TAB package. Previous attempts to make these measurements with a widely available commercial profilometer using laser triangulation failed. Keywords solder, thickness, profilometer, packaging



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