A.R.E.A.- A Roadmap Of Technology And Reliability Characterization
Authors: Denis Barbini, Ph.D. and Martin Anselm, Ph.D. Company: Universal Instruments Corporation Date Published: 10/13/2013
Abstract: In 2006 the transition to lead free in consumer electronics was primarily focused on lead-free alloy selection and material (board and component packaging) effects due to exposure to elevated temperature reflow processing. After approximately 7 years of manufacturing with lead-free alloys the consumer electronics market is driving the pitch, standoff, and PCB design requirements well beyond those adopted in 2006. Now, research has focused on circuit board design for routing of fine pitch devices, rework concerns with high cost fine pitch devices and Sn grain solidification behavior of excessively small solder joints. This research program is designed to address the challenges that these advanced packaging issues present and that, currently, are not fully understood.