SMTA International Conference Proceedings


Corrosion Resistance Of High Temperature Lead-Free BiAgX TM Paste

Authors: HongWen Zhang, RunSheng Mao and Ning-Cheng Lee, Ph.D.
Company: Indium Corporation
Date Published: 10/13/2013   Conference: SMTA International


Abstract: The corrosion resistance of BiAgX, a drop-in lead-free solder paste solution for high temperature die-attach applications, was investigated and compared with Pb5Sn2.5Ag and SAC305. Morphology observations indicated that BiAgX was much more corrosion resistant than Pb5Sn2.5Ag and SAC305. After salt water spray (SWS) plus temperature cycling tests (TCT), cracks were found on the surface of Pb5Sn2.5Ag and SAC305, but not on BiAgX.

Key Words: 

Corrosion resistance, high temperature, solder, lead-free, solder paste, die-attach



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