Author: Robert A. Williams Company: Hewlett Packard Date Published: 4/28/1997
Surface Mount International
Abstract: No clean SMT processes have been in place at HP’s Loveland Manufacturing Center since April of 1993. The advent of no-clean processes has adversely affected the goal of sustained low defect levels. Like other surface mount centers, the need to return to pre-no clean defect levels has been at the forefront of process engineering efforts. This paper will discuss some of the recent implementations of quality improvement measures at HP’s Loveland Manufacturing Center. At the same time, there will be a review of progressive steps that have been taken to improve the overall quality of the paste printing process. Finally, there will be an overview and explanation of experiments that were run at HP Loveland using the co-developed PC board for the 1996 and 1997 SMI Workshops.