SMTA International Conference Proceedings


Solder / Metallization Interdiffusion – Case Studies

Authors: Nausha Asrar, Ph.D.
Company: Schlumberger
Date Published: 10/13/2013   Conference: SMTA International


Abstract: While most of the industries are striving very hard to produce totally lead-free electronic products, many concerns remain regarding lead-free solder joint reliability. One major concern is the robustness of metallization of the electronic components for lead-free soldering. Metallization with tin and a high content of gold have been known to result in embrittlement and early failure in electronic assemblies. Therefore, information about the lead-free solder/metallization interdiffusion at high-temperature applications is very important for controlling the technological processes for the reliability of electronic interconnects. The challenges of solder/metallization interdiffusion during high-temperature applications and tests include gold embrittlement, intermetallics growth, void formation, and tin-whisker formation. This paper illustrates few case histories of such challenges. Some remedial measures are suggested to control the lead-free solder/metallization diffusion in the electronics interconnects.

Key Words: 

Interdiffusion, Embrittlement, Tin-whiskers, Intermetallics, Thermal cycling, Fracture.



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