Surface Mount International Conference Proceedings


PCB FABRICATION FOR SUCCESSFUL SOLDER PASTE

Author: George Trinite
Company: Elexsys International
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: The dynamic technology changes our industry has seen has introduced finer pitch components and more sophisticated electronic products. The traditional 100 and 50-mil (2.5 and 1.25 mm) pitch components of 10 years ago have evolved into the 20 and 16-mil (0.5 and 0.4 mm) devices of today with some advanced technologies such as TAB requiring 8-roil (0.2 mm) pitch. The ultra fine pitch component created a challenge for the PCB manufacturer not only to meet the customer requirements utilizing conventional processes but to deliver a more reliable product, faster and cheaper. These changes caused the PCB manufacturer to develop fabrication methods and materials that meet these new challenges. The primary focus of this article will be how the PCB fabricator can produce the surface planarity that is needed by the assembler for depositing an accurate, consistent volume of solder paste on the ultra fine pitch pads.



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