New Interconnection For High Temperature Application: HotPowCon (HPC) – Part 2Authors: Jörg Trodler, Mathias Nowottnick, and Andreas Fix, Timo Herberholz
Company: Heraeus Materials Technology GmbHo.KG, University of Rostock, and Robert Bosch GmbH
Date Published: 10/13/2013 Conference: SMTA International
The next steps for that project will be discussed in a description of the Assembly Process Technology, including the first results based on physical reliability tests as well as FEM simulation. It will describe the results for milestone 2, which means that the requirements for the process and the technology will include an overview of the test samples as well, and the necessary reliability test with the first results. Based on a FEM it will show possibilities for increasing the long-term stability.
New Interconnection, High Temperature, Power, Reliability, Assembly Process, HPC, IMC
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