Silica Gel Coating For Thermal Management Of Electronic Components
Authors: Mathias Nowottnick, Felix Bremerkamp and Dirk Seehase Company: University of Rostock Date Published: 10/13/2013
Abstract: Electronic assemblies and power electronic components generate a considerable power loss during operation. Often temporal power peaks and transient thermal loads stress the assembly. In this case it is necessary to remove the surplus heat rapidly in order to avoid critical operating temperatures. Cooling effects of melting processes are already well-known in the field of electronic technology, because of the high energetic potential of phase transition. In this contribution a concept is introduced to improve the thermal management of electronic assemblies by means of special desorption processes. It is shown that the use of a hygroscopic silica gel can dissipate a high amount of heat in short time periods. Silica gel is a solid and open porous material that is able to adsorb and store water molecules. The dehydration of silica gel can be accomplished by heating and it is connected with significant endothermic effects that can be used for dissipating surplus heat. A functional cover coating based on silica gel granulate provides an elegant concept to improve the thermal management of electronic components. The coating offers significant cooling effects due to desorption processes and it can be directly applied by dispensing systems. Thus temporal overheating can be prevented and the safe operation of the electronic assembly is ensured.