Thermal Cycle Fatigue Life Models For Wlcsp Solder Joints
Author: Robert Darveaux Company: Skyworks Solutions, Inc. Date Published: 10/13/2013
Abstract: Published data on WLCSP assemblies [1-3] were used to determine constants for thermal cycle fatigue life models. Six solder alloys were evaluated under four thermal cycle conditions. Finite element analysis was conducted to estimate the strain energy density per cycle for each condition and alloy. Both fatigue life and crack growth data showed good correlation with the simulation results. Multiple element mesh densities and post processing schemes were utilized, and all were found to be effective. Examples of using the constants to predict solder joint fatigue life were given.