SMTA International Conference Proceedings


Higher Density Pop Semiconductor Packaging Solution: Bridging The Infrastructure Gap Between Wire-Bond And TSV Interconnect

Authors: Vern Solberg, Belgacem Haba Ph.D., Wael Zohni, Ilyas Mohammed Ph.D. and Charles Woychik Ph.D.
Company: Invensas Corporation
Date Published: 10/13/2013   Conference: SMTA International


Abstract: The challenge for today's mobile devices is that they all need to support more advanced graphics processing. And to support this factor the industry requires an exponential increase in processor-to-memory bandwidth. This paper will introduce two innovative semiconductor package technologies designed to address these challenges; the Bond-Via-Array (BVA™) package, an ultra high-I/O Package-on-Package (PoP) solution and the xFD™ package assembly process, a very low profile stacked-die memory variation developed for high performance DRAM.

Key Words: 

3D, Package-on-Package, PoP, DRAM, Face- Down Die Stack, Wire-Bond, FBGA.



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