Effect Of Warpage On SMT Process Of Pop Package And Its Solution
Authors: Stephen Guo, Fubin Song, Jeff Qi and James Huang; and Alex Chen Company: Celestica Inc. Date Published: 10/13/2013
Abstract: In spite of the success has been made in PoP technology in the industry today, there are still some process / reliability issues in PoP package assembly. The warpage is more popular one among these issues. In this paper, the effect of the PoP warpage on the SMT process and its solution will be discussed in details. Warpage measurement and the related failure analysis will be performed as well. In addition, the optimization of SMT process will be introduced, including stencil design, solder paste selection, reflow profile optimization, and nitrogen application.