SMTA International Conference Proceedings

Demonstrated Process And Reliability Of 0.35 mm Pitch BGA Devices For Mobile Environment

Authors: Alan Choi, Brian Roggeman and Mark Schwarz
Company: Qualcomm Technologies, Inc.
Date Published: 10/13/2013   Conference: SMTA International

Abstract: The mobile and wireless industries will be the first to push below 0.4 mm pitch on BGA devices. Prior to full adoption, it is critical to define a robust SMT process and demonstrate both yield and reliability. Because of the miniature size, legacy design rules will be challenged and new processes and materials will be introduced.

This paper presents the results of SMT process optimization and reliability testing of BGA devices using less than 0.4 mm pitch. Variations in device geometry and SMT process were included. The SMT process was optimized for final assembly yields, using metrics of both electrical connectivity and soldering defects. Board level reliability was validated through drop/shock and thermal cycling testing, including full failure analysis for understanding of failure mode differences relative to packages with larger pitch. The results show that adoption of less than 0.4 mm pitch BGA devices is possible given current technology and process windows.

Key Words: 

0.35 mm Pitch, SMT, Warpage, Coplanarity, Board Level Reliability

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