Reliability Improvement Of Array QFN PackageAuthor: You-Chye How
Company: Texas Instruments Electronics Malaysia Sdn. Bhd.
Date Published: 10/13/2013 Conference: SMTA International
In this paper, Array QFN assembly process was introduced. Component level and board level reliability tests failures on Array QFN were investigated and analyzed on failure root causes for resolution. Meticulous selection of mold compound base on its critical properties helps reduce wire sweep percentage. Stencil design for SMT process was planned and experimentally conducted to achieve optimum barrel solder joints formation for better board level drop test reliability. Lead frame with different anchor design also plays important roles to improve board level drop test reliability in conjunction with optimum stencil design.
Etched back, anchor design, reliability, Array QFN, wire sweep, stencil design.
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