A Process For Improved QFN ReliabilityAuthors: Lenora Toscano, John Ganjei, Ph.D, Richard Retallick, and Gu Hong, Ph.D
Date Published: 10/13/2013 Conference: SMTA International
A process whereby tin is plated on the copper sidewall of the QFN after singulation has been developed to improve toe fillet solderability. Several assembly studies have been conducted which demonstrate improved QFN reliability due to the use of this toe fillet solderability process. The plating process, toe fillet inspection and improved QFN reliability after assembly due to the use of this toe fillet solderability is described.
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