Flex Based Embedded Die System In Package ModulesAuthors: Jon Aday, Theodore Tessier, and Kazuhisa Itoi
Company: FlipChip International, LLC and Fujikura Electron Device Laboratory
Date Published: 10/13/2013 Conference: SMTA International
The embedded die flex substrates allows for significant space savings when compared to conventional packaging technologies by embedding one or multiple components using a 3D approach to these structures. Additional components can also be placed using conventional SMT on the top or bottom side of the package.
This paper will focus on the assembly and reliability data of the embedded die SiP modules that have benefited from this technology. A comparison of the benefits will also be discussed comparing the embedded die SiP module versus the conventional SiP module configurations including size reduction and electrical benefits.
Polyimide Multilayer Flex, Laminate Embedded Die Substrates, System in Package (SiP) Modules
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.