SMTA International Conference Proceedings


Flex Based Embedded Die System In Package Modules

Authors: Jon Aday, Theodore Tessier, and Kazuhisa Itoi
Company: FlipChip International, LLC and Fujikura Electron Device Laboratory
Date Published: 10/13/2013   Conference: SMTA International


Abstract: Embedded die substrate technologies are being developed in an assortment of configurations and for different market segments. The technology discussed in this paper focuses on System in Package (SiP) modules that are based on embedding of die and components in multilayer polyimide flex substrates incorporating z-axis sintered metal interconnections.

The embedded die flex substrates allows for significant space savings when compared to conventional packaging technologies by embedding one or multiple components using a 3D approach to these structures. Additional components can also be placed using conventional SMT on the top or bottom side of the package.

This paper will focus on the assembly and reliability data of the embedded die SiP modules that have benefited from this technology. A comparison of the benefits will also be discussed comparing the embedded die SiP module versus the conventional SiP module configurations including size reduction and electrical benefits.

Key Words: 

Polyimide Multilayer Flex, Laminate Embedded Die Substrates, System in Package (SiP) Modules



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