CONTINUOUS IMPROVEMENT APPROACHES FOR WAVE SOLDERING PROCESSAuthor: Tony Huang
Date Published: 9/12/1999 Conference: SMTA International
This paper will describe the approaches taken and activities conducted by a wave soldering process improvement project team at Adaptec to overcome the various wave soldering issues when using no-clean flux. After achieving remarkable improvements in the wave soldering process, the team is now focusing on the implementation of a continuously improved wave soldering process. This paper will elaborate on the continuous improvement approaches used by the team. This paper will also show the details of the following activities:
Implementation of an SPC quality monitoring and defect feedback system. Use of Design of Experiment (DOE) to conduct the flux deposition analysis. Evaluation and selection of no clean flux. Application of DOE to achieve accurate wave profiling for different product families. Evaluation and refinement of PCB footprint designs for wave soldering process. Improvement of tooling design and use of universal selective wave fixtures for different product families.
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