ICSR (Soldering and Reliability) Conference Proceedings


Reliability Challenges For Bottom Termination Components

Authors: Brook Sandy-Smith
Company: Indium Corporation
Date Published: 5/14/2013   Conference: ICSR (Soldering and Reliability)


Abstract: There are many facets to PCB reliability and also a variety of strategies to ensure the most reliable assemblies. Bottom termination components, such as BGAs, CSPs, MLFs, QFNs, and D-Paks, pose additional challenges to some aspects of reliability. Three aspects will be addressed: electro-chemical reliability, assembly defects, and alloy reliability. For each aspect, unique challenges for BTCs, solutions, and strategies for optimization will be discussed. In order to maintain the highest quality of PCB assembly, all three must be considered and addressed at different phases of design and production.

Key Words: 

bottom termination components, QFNs, reliability, voiding



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