ICSR (Soldering and Reliability) Conference Proceedings


Process Control And Reliability Of Reworked Bga Solder Joint

Authors: Adrian Hirceaga and Ishrat Hasan
Company: Creation Technologies
Date Published: 5/14/2013   Conference: ICSR (Soldering and Reliability)


Abstract: One of the key aspects in electronics manufacturing is to ensure that the soldering specifications defined by the package manufacturers is fully implemented in production and a process is in place to maintain the reliability and repeatability of soldering. When re-working or replacing a part due to manufacturing or part defect, the work is typically done by hand soldering, a manual process that is then verified by the operator through manual inspection. In the case of BGA rework, it is a challenge to provide the same level of soldering conditions as the original soldering due to different architecture of the rework equipment. This challenge is further compounded with the smaller footprint packages such as micro BGAs, QFNs and LGAs. Minimal amounts of solder in small packages and handling of parts on the rework equipment reduces the process window. It is important that a process control is in place to maintain the amount of solder paste and suitable reflow condition to ensure a reliable reworked solder joint. This paper discusses the work done in identifying the key features for the right BGA rework equipment and the aspects important for a reliable and repeatable rework process for BGAs and bottom termination components. The work includes: ? leaded and lead-free BGAs ? achieving and replicating reflow conditions of a standard reflow oven in a BGA rework machine ? working with or without solder paste ? review of post reflow solder joint analysis

Key Words: 

BGA (Ball Grid Array); QFN (Quad Flat No-Leads); LGA (Land Grid Array); Rework; Repair; Profile, IMC (intermetallic compound)



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