Surface Mount International Conference Proceedings


CORROSION TESTING OF LOW SOLIDS AND FLIP CHIP FLUXES

Author: Brian A Smith
Company: Georgia Institute of Tech
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: In the rapidly changing world of electronic manufacturing, the one goal that has always remained prominent over all others is reliability. In addition to the drive for reliable processes, increasingly strict environmental laws such as the Clean Air Act and the Montreal Protocol[l] have made the selection of proper materials even more important. With the phasing out of CFC cleaning agents, traditional rosin based materials are being replaced by newer, more complex formulations. No-clean liquid fluxes and pastes are among the newest such materials to fill this role. And with the increasing complexity of these materials, more accurate test methods must be used in order to determine accurately and rapidly which of these materials will be suitable for ~ particular process. In addition to studying these new formulations, the active raw materials that make up these fluxes must also be studied in order to understand how they wok and also to aid in the development of new formulations. The testing that was performed for this paper attempts to study both no-clean liquid fluxes and pastes as well as examines the weak organic acids which are used in no clean flux formulations.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819