CORROSION TESTING OF LOW SOLIDS AND FLIP CHIP FLUXES
Author: Brian A Smith Company: Georgia Institute of Tech Date Published: 4/28/1997
Surface Mount International
Abstract: In the rapidly changing world of electronic manufacturing, the one goal that has always remained prominent over all others is reliability. In addition to the drive for reliable processes, increasingly strict environmental laws such as the Clean Air Act and the Montreal Protocol[l] have made the selection of proper materials even more important. With the phasing out of CFC cleaning agents, traditional rosin based materials are being replaced by newer, more complex formulations. No-clean liquid fluxes and pastes are among the newest such materials to fill this role. And with the increasing complexity of these materials, more accurate test methods must be used in order to determine accurately and rapidly which of these materials will be suitable for ~ particular process. In addition to studying these new formulations, the active raw materials that make up these fluxes must also be studied in order to understand how they wok and also to aid in the development of new formulations. The testing that was performed for this paper attempts to study both no-clean liquid fluxes and pastes as well as examines the weak organic acids which are used in no clean flux formulations.