Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 1 – AXI Capability for HoP DetectionAuthors: Alex Chan, Paul Brown, Lars Bruno, Anne-Kathrine Knoph, Thilo Sack, David Geiger, David Mendez, Mulugeta Abtew, Iulia Muntele, and Michael Meilunas
Company: Alcatel-Lucent, Ericsson, Celestica Inc., Flextronics International, Sanmina Corporation, Universal Instruments Corporation
Date Published: 5/14/2013 Conference: ICSR (Soldering and Reliability)
HoP, BGA, AXI, x-ray
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