DIELECTRICS FOR EMBEDDING ACTIVE AND PASSIVE COMPONENTS
Authors: J. Kress, R. Park, A. Bruderer, and N. Galster; and SH Cho Company: Atotech Deutschland GmbH and Dongyang Mirae University Date Published: 1/22/2013
Pan Pacific Symposium
Abstract: Embedding of actives and passives is a quickly growing field which is being investigated by many companies and institutes. Reasons for this increasing interest are to reduce the complexity of the packages, achievement of higher degree of miniaturization, shorter electrical connections, and a reduction of layer count. Among other technical challenges, warpage is a major concern. The inherent different thermomechanical properties of the different materials involved cause internal stresses. Those stresses show up as warpage which makes handling during production more difficult, reduces the overall yield, and imparts reliability. Presented in this paper is a composite type material which can be used as dielectric for the embedding of actives and passives. It combines the advantages of the mechanical stability of prepregs and the good encapsulation properties and ease of handling of resin coated copper foils (RCC). Also described is a concept for simulating the warpage of packages using such composite build-up materials taking into account different resin properties.