Pan Pacific Symposium Conference Proceedings


IMPACT OF LEAD-FREE COMPONENTS AND TECHNOLOGY SCALING FOR HIGH RELIABILITY APPLICATIONS

Authors: Chris Bailey, Ph.D.
Company: University of Greenwich
Date Published: 1/22/2013   Conference: Pan Pacific Symposium


Abstract: Semiconductor technology is increasingly meeting the demands and challenges posed by roadmaps such as ITRS in terms of technology scaling and packaging, where the interconnect size is decreasing to ever smaller dimensions. The drive for this is increasing functionality of the devices and is governed primarily by the consumer electronics markets. For applications in high reliability sectors such as aerospace, automotive, oil and gas, etc, this scaling in technology, and the use of lead-free solders to satisfy ROHS legislation, is posing a number of challenges. This paper discusses current status in using lead-free components for high reliability applications and developments in modelling that can aid organisations in assessing different design options before using lead-free COTS components in their applications.

Key Words: 

Lead-free, refinishing, technology scaling, metal migration and reliability



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819