IMPACT OF LEAD-FREE COMPONENTS AND TECHNOLOGY SCALING FOR HIGH RELIABILITY APPLICATIONS
Authors: Chris Bailey, Ph.D. Company: University of Greenwich Date Published: 1/22/2013
Pan Pacific Symposium
Abstract: Semiconductor technology is increasingly meeting the demands and challenges posed by roadmaps such as ITRS in terms of technology scaling and packaging, where the interconnect size is decreasing to ever smaller dimensions. The drive for this is increasing functionality of the devices and is governed primarily by the consumer electronics markets. For applications in high reliability sectors such as aerospace, automotive, oil and gas, etc, this scaling in technology, and the use of lead-free solders to satisfy ROHS legislation, is posing a number of challenges. This paper discusses current status in using lead-free components for high reliability applications and developments in modelling that can aid organisations in assessing different design options before using lead-free COTS components in their applications.
Lead-free, refinishing, technology scaling, metal migration and reliability